HTC UHV Chamber

An ultra-high vacuum chamber for synchrotron radiation research and university experiments. The SS304 or SS316 body is electropolished, baked at 120 °C for 24 hours and shipped after reaching below 7.5x10⁻¹⁰ torr.

HTC UHV ChamberHTC UHV Chamber 2

Specifications

MaterialSS304, SS304L, SS316
Surface TreatmentElectropolished
Leak Rate<2x10⁻¹⁰ mbar·l/s
Pressure After Baking<7.5x10⁻¹⁰ torr (after 120 °C bake for 24 h)
RGA Total Pressure<1x10⁻⁹ torr, species above 45 amu <0.3%
TypeSynchrotron radiation research, academic research, standardized design, customized design

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